5G application oriented
25G/100G
High speed electric chip scheme
Application oriented F5G access network
1.25G/2.5G/10G/25G/50G
High speed electric chip scheme
Data center oriented applications
100G/400G/800G
High speed electric chip scheme
Performance and cost advantages
Differentiation:the world's first on-chip integrated OAM technology
integrate LA、LDD and CDR
Performance, cost and integration advantages
Differentiation:the world's first on-chip integrated OAM technology
Systematically support the realization of on-chip integrated OAM function
Integrate all physical layer, link layer and a few business layer requirements
Only a small amount of resistance and capacitance components need to be added, which has high compatibility with the original module and low upgrade cost
Systematically optimize the on-chip integrated OAM function unit, with extremely low increment of power consumption
Simple application design, high reliability, strong system compatibility and more stable operation
Full duplex design of physical layer and link layer to ensure communication success rate
Solve the pain points from transition scheme, which is structured as "main chip + MCU + FPGA"